Footprint names can be derived by combining the name of the component
category with a dimensional aspect of the component and the number of pins
followed by a suffix derived from the environmental application.
If additional characteristcs are required they should be added as an
alphabetical character, or combinations of characters that preceed the suffix.
Sample Name: QFP65P + Lead Span L1 X Lead Span L2 Nominal - Pin Qty
The + (plus sign) stands for “in addition to” (no space between the prefix and
the body size).
The - (dash) is used to separate the pin qty.
The X (capital letter X) is used instead of the word “by” to separate two
numbers such as height X width like “Quad Packages”.
Suffixes for every common SMT footprint describe the environment application
(this is the last character in every name).
Note: This excludes the BGA which only comes in Nominal Environment Condition.
Three footprint geometry variations are supplied for each of the device
families;
HS - Footprint with Heat Sink attachment requiring additional holes or pads.
Example:TO254P1055_HS-6N
BEC - Base, Emitter and Collector (pin assignments used for three pin transistors)
SGD - Source, Gate and Drain (pin assignments used for three pin transistors)
213 - Alternate pin assignments used for three pin transistors.
Prefix | Component | Footprint Name Definition |
BGA | BGA, Inch Based (1.27mm / 0.05” Pitch) | BGA127P + Number of Pin Columns X Number of Pin Rows X Height - Pin Qty |
BGA | BGA, Metric Based (1.50mm Pitch) | BGA150P + Number of Pin Columns X Number of Pin Rows X Height - Pin Qty |
BGA | BGA, Metric Based (1.00mm Pitch) | BGA100P + Number of Pin Columns X Number of Pin Rows X Height - Pin Qty |
BGA | BGA, Metric Based (0.80mm Pitch) | BGA80P + Number of Pin Columns X Number of Pin Rows X Height - Pin Qty |
BGA | BGA, Metric Based (0.75mm Pitch) | BGA75P + Number of Pin Columns X Number of Pin Rows X Height - Pin Qty |
BGA | BGA, Metric Based (0.65mm Pitch) | BGA65P + Number of Pin Columns X Number of Pin Rows X Height - Pin Qty |
BGA | BGA, Metric Based (0.50mm Pitch) | BGA50P + Number of Pin Columns X Number of Pin Rows X Height - Pin Qty |
SBGA | BGA, w/Staggered Pins (1.27mm Pitch) | SBGA127P + Number of Pin Columns X Number of Pin Rows X Height - Pin Qty |
CAPCA | Capacitors, Chip Array | CAPCA + (nom) Body Width X (nom) Body Length X Height - Pin Qty |
CAPC | Capacitors, Chip, Non-polarized | CAPC + Body Length + Body Width X Height |
CAPCP | Capacitors, Chip, Polarized | CAPCP + Body Length + Body Width X Heightc |
CAPCWR | Capacitors, Chip, Wire Rectangular | CAPCWR + Body Length + Body X Height |
CAPM | Capacitors, Molded body, Non-polarized | CAPM + Body Length + Body Width X Height |
CAPTMP | Capacitors, Molded body, Polarized | CAPTMP + Body Length + Body Width X Height |
CAPAE | Capacitors, Aluminum Electrolytic | CAPAE + Body Width X Height |
CFP | Ceramic Flat Packages | CFP127P + (nom) Lead Span X Height - Pin Qty |
CGA | Column Grid Array's | CGA + Number of Pin Columns X Number of Pin Rows X Height - Pin Qty |
DIOMELF | Diodes, MELF | DIOMELF + Body Length + Body Width |
DIOM | Diodes, Molded | DIOM + Body Length + Body Width X Height |
INDCA | Inductors, Chip Array | INDCA + Body Length + Body Width X Height |
INDC | Inductors, Chip | INDC + Body Length + Body Width X Height |
INDM | Inductors, Molded | INDM + Body Length + Body Width X Height |
INDP | Inductors, Precision Wire Wound | INDP + Body Length + Body Width X Height |
PLCC | Plastic Leaded Chip Carriers | PLCC + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty |
PLCCS | Plastic Leaded Chip Carrier Sockets Rect. | PLCCS + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty |
PQFPS | Plastic QFP, 0.635mm Pitch, Pin 1 Corner | PQFPS + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty |
PQFPC | Plastic QFP, 0.635mm Pitch, Pin 1 Center | PQFPC + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty |
BQFPS | Bump QFP, 0.635mm Pitch, Pin 1 Corner | BQFPS + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty |
BQFPC | Bump QFP, 0.635mm Pitch, Pin 1 Center | BQFPC + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty |
QFP | Quad Flat Packages, 1.00mm Pitch | QFP100P + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty |
QFP | Quad Flat Packages, 0.80mm Pitch | QFP80P + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty |
QFP | Quad Flat Packages, 0.65mm Pitch | QFP65P + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty |
SQFP | Shrink Quad Flat Packages, 0.50mm Pitch | SQFP50P + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty |
SQFP | Shrink Quad Flat Packages, 0.40mm Pitch | SQFP40P + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty |
SQFP | Shrink Quad Flat Packages, 0.30mm Pitch | SQFP30P + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty |
TQFP | Thin QFP, 0.80mm Pitch, Height =< 1.60mm | TQFP80P + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty |
TQFP | Thin QFP, 0.65mm Pitch, Height =< 1.60mm | TQFP65P + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty |
TQFP | Thin QFP, 0.50mm Pitch, Height =< 1.60mm | TSQFP50P + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty |
TQFP | Thin QFP, 0.40mm Pitch, Height =< 1.60mm | TSQFP40P + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty |
TQFP | Thin QFP, 0.30mm Pitch, Height =< 1.60mm | TSQFP30P + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty |
CQFP | Ceramic Quad Flat Packages, 1.27mm Pitch | CQFP127P + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty |
CQFP | Ceramic Quad Flat Packages, 0.80mm Pitch | CQFP80P + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty |
CQFP | Ceramic Quad Flat Packages, 0.635mm Pitch | CQFP63P + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty |
QFN | Quad Flat No Lead Packages 0.80mm Pitch | QFN80P - (nom) Body Width X (nom) Body Length X Height - Pin Qty |
QFN | Quad Flat No Lead Packages 0.65mm Pitch | QFN65P - (nom) Body Width X (nom) Body Length X Height - Pin Qty |
QFN | Quad Flat No Lead Packages 0.50mm Pitch | QFN50P - (nom) Body Width X (nom) Body Length X Height - Pin Qty |
QFN | Quad Flat No Lead Packages 0.40mm Pitch | QFN40P - (nom) Body Width X (nom) Body Length X Height - Pin Qty |
LCC | Quad Leadless Chip Carriers | LCC + (nom) Body Width X (nom) Body Length X Height - Pin Qty |
RESCA | Resistors, Chip Array | RESCA + (nom) Body Width X (nom) Body Length X Height - Pin Qty |
RESC | Resistors, Chip | RESC + Body Length + Body Width X Height |
RESM | Resistors, Molded | RESM + Body Length + Body Width X Height |
RESMELF | Resistors, MELF | RESMELF + Body Length + Body Width |
SOJ | SO, J-Leaded ( 0.5mm-1.27mm Pitch) | SOJ + Pitch P + (nom) Lead Span X Height - Pin Qty |
SOIC | Small Outline IC, 1.27mm Pitch (Std) | SOIC127P + (nom) Lead Span X Height - Pin Qty |
SOP | Small Outline Packages, 1.27mm Pitch (Non-Std) | SOP127P + (nom) Lead Span X Height - Pin Qty |
SOP | Small Outline Packages, 1.00mm Pitch | SOP100P + (nom) Lead Span X Height - Pin Qty |
SOP | Small Outline Packages, 0.80mm Pitch | SOP80P + (nom) Lead Span X Height - Pin Qty |
SOP | Small Outline Packages, 0.65mm Pitch | SOP65P + (nom) Lead Span X Height - Pin Qty |
SOP | Small Outline Packages, 0.635mm Pitch | SOP63P + (nom) Lead Span X Height - Pin Qty |
SSOP | Shrink SOP, 0.50mm Pitch | SSOP50P + (nom) Lead Span X Height - Pin Qty |
SSOP | Shrink SOP, 0.40mm Pitch | SSOP40P + (nom) Lead Span X Height - Pin Qty |
SSOP | Shrink SOP, 0.30mm Pitch | SSOP30P + (nom) Lead Span X Height - Pin Qty |
TSOP | Thin SOP, H =< 1.60mm, 1.27mm Pitch | TSOP127P + (nom) Lead Span X Height - Pin Qty |
TSOP | Thin SOP, H =< 1.60mm, 1.00mm Pitch | TSOP100P + (nom) Lead Span X Height - Pin Qty |
TSOP | Thin SOP, H =< 1.60mm, 0.80mm Pitch | TSOP80P + (nom) Lead Span X Height - Pin Qty |
TSOP | Thin SOP, H =< 1.60mm, 0.65mm Pitch | TSOP65P + (nom) Lead Span X Height - Pin Qty |
TSSOP | Thin SSOP, H =< 1.6mm, 0.55mm Pitch | TSSOP55P + (nom) Lead Span X Height - Pin Qty |
TSSOP | Thin SSOP, H =< 1.6mm, 0.50mm Pitch | TSSOP50P + (nom) Lead Span X Height - Pin Qty |
TSSOP | Thin SSOP, H =< 1.6mm, 0.40mm Pitch | TSSOP40P + (nom) Lead Span X Height - Pin Qty |
TSSOP | Thin SSOP, Thin ,H =< 1.6mm, 0.30mm Pitch | TSSOP30P + (nom) Lead Span X Height - Pin Qty |
SOP | Small Outline Diode | SOD + (nom) Lead Span + (nom) Body Width X Height - Pin Qty |
SON | Small Outline No-Lead | SON + Pitch P - (nom) Body Width X (nom) Body Length X Height - Pin Qty |
TO | TO (Generic DPAK) | TO + Pitch P + (nom) Lead Span X Height - Pin Qty |
SOT | SOT (Generic) | SOT + Pitch P + (nom) Lead Span X Height - Pin Qty |
Prefix | Component | Footprint Name Definition |