Name Syntax.

Footprint names can be derived by combining the name of the component category with a dimensional aspect of the component and the number of pins followed by a suffix derived from the environmental application.
If additional characteristcs are required they should be added as an alphabetical character, or combinations of characters that preceed the suffix.

Sample Name: QFP65P + Lead Span L1 X Lead Span L2 Nominal - Pin Qty

The + (plus sign) stands for “in addition to” (no space between the prefix and the body size).

The - (dash) is used to separate the pin qty.

The X (capital letter X) is used instead of the word “by” to separate two numbers such as height X width like “Quad Packages”.

SUFFIXES

Suffixes for every common SMT footprint describe the environment application (this is the last character in every name).
Note: This excludes the BGA which only comes in Nominal Environment Condition.

Three footprint geometry variations are supplied for each of the device families;

Before adapting the minimum footprint variations the user should consider product qualification testing and the manufacturer's datasheets.
The use of classes of performance (1, 2, and 3) is combined with that of component density levels (A, B, and C) in explaining the condition of an electronic assembly.
As an example, combining the description as Levels 1A or 3B or 2C, would indicate the different combinations of performance and component density to aid in understanding the environment and the manufacturing requirements of a particular assembly.

A - Alternate component: (used primarily for SOP & QFP when component tolerance or height is different) AA, AB, etc.

JEDEC or EIA component identifier: used primarily on chip resistors, inductors and capacitors.

General Sufixes

HS - Footprint with Heat Sink attachment requiring additional holes or pads.
Example:TO254P1055_HS-6N

BEC - Base, Emitter and Collector (pin assignments used for three pin transistors)

SGD - Source, Gate and Drain (pin assignments used for three pin transistors)

213 - Alternate pin assignments used for three pin transistors.

SMT footprint name definitions.

PrefixComponentFootprint Name Definition
BGABGA, Inch Based (1.27mm / 0.05” Pitch)BGA127P + Number of Pin Columns X Number of Pin Rows X Height - Pin Qty
BGABGA, Metric Based (1.50mm Pitch)BGA150P + Number of Pin Columns X Number of Pin Rows X Height - Pin Qty
BGABGA, Metric Based (1.00mm Pitch)BGA100P + Number of Pin Columns X Number of Pin Rows X Height - Pin Qty
BGABGA, Metric Based (0.80mm Pitch)BGA80P + Number of Pin Columns X Number of Pin Rows X Height - Pin Qty
BGABGA, Metric Based (0.75mm Pitch)BGA75P + Number of Pin Columns X Number of Pin Rows X Height - Pin Qty
BGABGA, Metric Based (0.65mm Pitch)BGA65P + Number of Pin Columns X Number of Pin Rows X Height - Pin Qty
BGABGA, Metric Based (0.50mm Pitch)BGA50P + Number of Pin Columns X Number of Pin Rows X Height - Pin Qty
SBGABGA, w/Staggered Pins (1.27mm Pitch)SBGA127P + Number of Pin Columns X Number of Pin Rows X Height - Pin Qty
CAPCACapacitors, Chip ArrayCAPCA + (nom) Body Width X (nom) Body Length X Height - Pin Qty
CAPCCapacitors, Chip, Non-polarizedCAPC + Body Length + Body Width X Height
CAPCPCapacitors, Chip, PolarizedCAPCP + Body Length + Body Width X Heightc
CAPCWRCapacitors, Chip, Wire RectangularCAPCWR + Body Length + Body X Height
CAPMCapacitors, Molded body, Non-polarizedCAPM + Body Length + Body Width X Height
CAPTMPCapacitors, Molded body, PolarizedCAPTMP + Body Length + Body Width X Height
CAPAECapacitors, Aluminum ElectrolyticCAPAE + Body Width X Height
CFPCeramic Flat PackagesCFP127P + (nom) Lead Span X Height - Pin Qty
CGAColumn Grid Array'sCGA + Number of Pin Columns X Number of Pin Rows X Height - Pin Qty
DIOMELFDiodes, MELFDIOMELF + Body Length + Body Width
DIOMDiodes, MoldedDIOM + Body Length + Body Width X Height
INDCAInductors, Chip ArrayINDCA + Body Length + Body Width X Height
INDCInductors, ChipINDC + Body Length + Body Width X Height
INDMInductors, MoldedINDM + Body Length + Body Width X Height
INDPInductors, Precision Wire WoundINDP + Body Length + Body Width X Height
PLCCPlastic Leaded Chip CarriersPLCC + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty
PLCCSPlastic Leaded Chip Carrier Sockets Rect.PLCCS + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty
PQFPSPlastic QFP, 0.635mm Pitch, Pin 1 CornerPQFPS + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty
PQFPCPlastic QFP, 0.635mm Pitch, Pin 1 CenterPQFPC + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty
BQFPSBump QFP, 0.635mm Pitch, Pin 1 CornerBQFPS + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty
BQFPCBump QFP, 0.635mm Pitch, Pin 1 CenterBQFPC + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty
QFPQuad Flat Packages, 1.00mm PitchQFP100P + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty
QFPQuad Flat Packages, 0.80mm PitchQFP80P + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty
QFPQuad Flat Packages, 0.65mm PitchQFP65P + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty
SQFPShrink Quad Flat Packages, 0.50mm PitchSQFP50P + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty
SQFPShrink Quad Flat Packages, 0.40mm PitchSQFP40P + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty
SQFPShrink Quad Flat Packages, 0.30mm PitchSQFP30P + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty
TQFPThin QFP, 0.80mm Pitch, Height =< 1.60mmTQFP80P + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty
TQFPThin QFP, 0.65mm Pitch, Height =< 1.60mmTQFP65P + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty
TQFPThin QFP, 0.50mm Pitch, Height =< 1.60mmTSQFP50P + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty
TQFPThin QFP, 0.40mm Pitch, Height =< 1.60mmTSQFP40P + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty
TQFPThin QFP, 0.30mm Pitch, Height =< 1.60mmTSQFP30P + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty
CQFPCeramic Quad Flat Packages, 1.27mm PitchCQFP127P + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty
CQFPCeramic Quad Flat Packages, 0.80mm PitchCQFP80P + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty
CQFPCeramic Quad Flat Packages, 0.635mm PitchCQFP63P + (nom) Leadspan1 X (nom) Leadspan2 X Height - Pin Qty
QFNQuad Flat No Lead Packages 0.80mm PitchQFN80P - (nom) Body Width X (nom) Body Length X Height - Pin Qty
QFNQuad Flat No Lead Packages 0.65mm PitchQFN65P - (nom) Body Width X (nom) Body Length X Height - Pin Qty
QFNQuad Flat No Lead Packages 0.50mm PitchQFN50P - (nom) Body Width X (nom) Body Length X Height - Pin Qty
QFNQuad Flat No Lead Packages 0.40mm PitchQFN40P - (nom) Body Width X (nom) Body Length X Height - Pin Qty
LCCQuad Leadless Chip CarriersLCC + (nom) Body Width X (nom) Body Length X Height - Pin Qty
RESCAResistors, Chip ArrayRESCA + (nom) Body Width X (nom) Body Length X Height - Pin Qty
RESCResistors, ChipRESC + Body Length + Body Width X Height
RESMResistors, MoldedRESM + Body Length + Body Width X Height
RESMELFResistors, MELFRESMELF + Body Length + Body Width
SOJSO, J-Leaded ( 0.5mm-1.27mm Pitch)SOJ + Pitch P + (nom) Lead Span X Height - Pin Qty
SOICSmall Outline IC, 1.27mm Pitch (Std)SOIC127P + (nom) Lead Span X Height - Pin Qty
SOPSmall Outline Packages, 1.27mm Pitch (Non-Std)SOP127P + (nom) Lead Span X Height - Pin Qty
SOPSmall Outline Packages, 1.00mm PitchSOP100P + (nom) Lead Span X Height - Pin Qty
SOPSmall Outline Packages, 0.80mm PitchSOP80P + (nom) Lead Span X Height - Pin Qty
SOPSmall Outline Packages, 0.65mm PitchSOP65P + (nom) Lead Span X Height - Pin Qty
SOPSmall Outline Packages, 0.635mm PitchSOP63P + (nom) Lead Span X Height - Pin Qty
SSOPShrink SOP, 0.50mm PitchSSOP50P + (nom) Lead Span X Height - Pin Qty
SSOPShrink SOP, 0.40mm PitchSSOP40P + (nom) Lead Span X Height - Pin Qty
SSOPShrink SOP, 0.30mm PitchSSOP30P + (nom) Lead Span X Height - Pin Qty
TSOPThin SOP, H =< 1.60mm, 1.27mm PitchTSOP127P + (nom) Lead Span X Height - Pin Qty
TSOPThin SOP, H =< 1.60mm, 1.00mm PitchTSOP100P + (nom) Lead Span X Height - Pin Qty
TSOPThin SOP, H =< 1.60mm, 0.80mm PitchTSOP80P + (nom) Lead Span X Height - Pin Qty
TSOPThin SOP, H =< 1.60mm, 0.65mm PitchTSOP65P + (nom) Lead Span X Height - Pin Qty
TSSOPThin SSOP, H =< 1.6mm, 0.55mm PitchTSSOP55P + (nom) Lead Span X Height - Pin Qty
TSSOPThin SSOP, H =< 1.6mm, 0.50mm PitchTSSOP50P + (nom) Lead Span X Height - Pin Qty
TSSOPThin SSOP, H =< 1.6mm, 0.40mm PitchTSSOP40P + (nom) Lead Span X Height - Pin Qty
TSSOPThin SSOP, Thin ,H =< 1.6mm, 0.30mm PitchTSSOP30P + (nom) Lead Span X Height - Pin Qty
SOPSmall Outline DiodeSOD + (nom) Lead Span + (nom) Body Width X Height - Pin Qty
SONSmall Outline No-LeadSON + Pitch P - (nom) Body Width X (nom) Body Length X Height - Pin Qty
TOTO (Generic DPAK)TO + Pitch P + (nom) Lead Span X Height - Pin Qty
SOTSOT (Generic)SOT + Pitch P + (nom) Lead Span X Height - Pin Qty

TH footprint name definitions.

PrefixComponentFootprint Name Definition


Updated: January 28th, 2010 by Bert Timmerman.